E-Fill™ Conductive Fillers

Sulzer Metco Canada’s E-Fill™ conductive fillers are used in coatings, inks, adhesives, tapes, EMI gaskets, elastomers and sealants to provide exceptional EMI / RFI shielding, conductivity and heat transfer capabilities. E-Fill™ is ideally suited for applications in electronic devices. Sulzer Metco Canada’s proprietary hydro-metallurgical process ensures a nickel coating that is continuous and uniform resulting in a highly conductive filler material.

Conductive Additives for EMI Gaskets

Our flagship E-Fill™ product, nickel graphite powder, is the preferred conductive filler in the formulation of raw material for EMI gaskets and seals. Ni graphite powders are polymer additives that are usually combined with silicone to form thermally and electrically conductive elastomers. These nickel graphite conductive fillers give EMI gaskets shielding capabilities comparable to that of silver conductive filler additives over a wide frequency range.

An additional benefit of E-Fill™ nickel graphite is its angular shape coupled with Sulzer Metco Canada’s proprietary highly conductive hard nickel coating that gives the gasket material the ‘bite’ needed to ensure the best electrically conductive seal that enhances both RFI & EMI shielding and environmental sealing.

Sulzer Metco Canada’s Ni-graphite conductive filler is aluminum compatible and offers enhanced galvanic corrosion resistance and stability in severe environments.

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Nickel Powders

Sulzer Metco Canada has been manufacturing consistent high quality nickel powders for over 35 years and is a leading supplier of >99.8% pure, specialty nickel powders.

We are also a supplier of nickel clad composite powders with metallic and non-metallic cores and other metal clad composite powders ranging in size from 20 to over 300 microns. Given Sulzer Metco Canada’s 40 years of experience in manufacturing nickel powders and metal clad composite materials you can feel confident in our ability to surpass your needs with every lot.

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Nickel Gold Conductive Fillers

Sulzer Metco Canada currently supplies a variety of gold coated materials into the electronics market.  Ni-Au clad composite powders offer significant cost savings and performance benefits over traditional gold-based conductive polymer additives for use in electronic packaging applications.  Sulzer Metco Canada’s flexibility in material design ensures that your product’s performance and cost targets are met.

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